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Selective Wave Soldering
There are 2 main categories for components and mounting technology, Through Hole and Surface Mounted.
Through Hole Technology (THT) is the original assembly process that dominated the industry until the invention of Surface Mount Technology (SMT) in the mid 80’s.
One of the soldering techniques for THT is the use of Selective Wave Soldering.
Selective soldering is a variant of wave soldering, the equipment makes a small solder alloy wave within a nozzle and moves this wave to the THT joints that are to be soldered. Selective soldering consists of three steps:
- Application of liquid flux
- Preheating of the printed circuit board
- Soldering with a specific solder nozzle.
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Glossary
To simplify communication Eurocircuits uses abbreviations for many of these technical terms. Most of the technical terms and abbreviations are international standards in the Printed Circuit Board manufacturing industry. However to make it clear to everyone involved, we here present a list of technical terms and abbreviations along with their explanation.
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