Component Clearances

The maximum component boundary defines the outermost boundary of the component including both the edge of the package and the end of the leads. Minimum placement courtyard is defined around the part that includes the body and the basic land pattern. The outermost area is the courtyard manufacturing zone which is a „keep out” for other components, hardware and board edge. Also, one of the key aspects of the courtyard manufacturing zone is that it allows room for rework.

  • Unless otherwise specified, clearance is 0.25mm.
  • Components smaller than 0603 should have a clearance of 0.15mm.
  • Connectors, canned capacitors and crystals should have a clearance of 0.5mm, in addition to the clearance required for mating of the connector.
  • BGA devices should have a clearance of 1.0mm.


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To simplify communication Eurocircuits uses abbreviations for many of these technical terms. Most of the technical terms and abbreviations are international standards in the Printed Circuit Board manufacturing industry. However to make it clear to everyone involved, we here present a list of technical terms and abbreviations along with their explanation.
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