DEFINED IMPEDANCE pool – Bare board & assembly services
Eurocircuits’ PCB DEFINED IMPEDANCE pool is a fast turnaround solution for PCB’s with a specific impedance requirements for certain tracks.
The online menus contain a calculator to help you to define the correct track and gap values for your layout, for example for 50Ω characteristic and 90Ω differential impedance using material with a guaranteed dielectric constant (εr).
A single clear smart menu structure gives you immediate access to Eurocircuits’ wide range of pooling and non-pooling options. The menu will flag non-poolable items, so that you can change them for lower cost pooling options where possible.
Pooling prices are based on panel-sharing. Non-pooling prices are based on a production panel specific to the option and the job.
Boards can be supplied as single circuits or panels.
The standard price matrix shows alternative (lower-cost) quantities and deliveries, or set your own custom matrix. If your requirements are not covered, use Place inquiry to send your data to our engineers for evaluation.
What’s Available
- Bare Board or Assembled PCB’s
- Standard lead times:
- Bare Board PCB’s in 5 Working Days*
- Assembled PCB’s in 10 Working Days*
- Shorter lead times are available in the PCB Calculator
- 4, 6 and 8 Layers from 1 Piece Onwards
- 100µm Track & Gap pooling – 90 µm Non-pooling
- 2 Soldermasks and 1 or 2 Legends/Silkscreens
- Lead-free Finishes: Electroless Gold over Nickel or Lead-free HAL pooling – Immersion Silver Non-pooling
- IS400 – FR-4 – RoHS Compliant Material Optimised for Lead-free Soldering (see also our blog) about materials and lead-free soldering)
- Standard Buildups (pooling) or Predefined Non-pooling Builds Available (Specials after evaluation)
- Smart Menu Covering all PCB Manufacturing Options
- Wide Range of Options Available
- No Tooling Charges
- No Minimum Order Charge.
- 100% Manufacturability Check Prior to Production
- 100% Electrical Test
- PCB Configurator to check and upload design parameters before pricing
- PCB Checker to analyses your data before you place your order
- BOM and CPL analysis
DEFINED IMPEDANCE pool Service Parameters | |
Number of Layers |
4, 6 or 8 Non-Pooling – Others available in the online calculator |
Maximum PCB Dimension |
500mm x 425mm for ML |
Minimum Dimension |
5mm x 5mm for PCB’s 50mm x 50mm for panels |
Base Material (pooled) |
|
Base Material High Tg (Non pooled) | |
Board Thickness |
Pooling – 1.00mm (4 layers only) Pooling – 1.55mm Non-Pooling – Others available in the online calculator |
Base Copper Foil – Outer Layers |
Pooling – 18µm, 35µm Non-Pooling – others available in the online calculator |
Base Copper Foil – Inner Layers |
Pooling – 18µm, 35µm Non-Pooling – others available in the online calculator |
Surface Finish |
Pooling – Lead-free for best price, ENIG, LF HAL, IM Ag |
Soldermask Type/Colour |
Pooling – Green, Blue, Black, White, Red, PixtureBlackWhite Non-Pooling – Transparent |
Extra Options |
Pooling – Peelable Mask, Via Filling, Heatsink Paste, Gold Edge Connectors Non-Pooling – Carbon Pads |
Legend Type/Colour |
Pooling – White on one or both sides Non-Pooling – Black & White PIL |
Min. Track Width/Spacing |
Pooling – 0.100mm Non-Pooling – 0.090mm |
Min. Finished Hole Size |
PTH – 0.100mm NPTH – 0.200mm Non-Pooled – others available in the online calculator |
Minimum Outer Layer Pad Diameter |
PTH is Finished Hole Size + 0.300mm NPTH is Finished Hole Size + 0.200mm |
Minimum Inner Layer Pad Diameter |
PTH is Finished Hole Size + 0.350mm NPTH is Finished Hole Size + 0.250mm |
Minimum Copper to Board-edge Clearance – Outer Layers |
Routed – 0.250mm V-cut – 0.450mm |
Minimum Copper to Board-edge Clearance – Inner Layers |
Routed – 0.400mm V-cut – 0.450mm |
Extra Copper Features |
Copper up to Edge Plated Holes on Edge Round-edge Plating |
Slots and Cut-outs |
Tool Sizes – 0.5, 1.2, & 2.0mm |
Delivery Panels |
Break-routed with 2 mm Tool or V-cut |
Maximum Customer Panel that can be eC-compatible |
350 x 250mm |
Minimum Customer Panel that can be eC-comaptible |
50 x 50 mm |
Multilayer-build |
Pooled; eC-predefined buildups: 2 for 4L and 1 for all others Non-pooled; eC-predefined buildups with possibilities to include blind and buried vias Use our online buildup editor which includes +/-800 eC-predefined buildups |
Electrical Test |
Standard |
UL marking |
Available |
Stencil Material |
100µm and 130µm Stainless Steel |
Maximum Stencil Size |
595 x 595 mm |
DEFINED IMPEDANCE pool Assembly Service Parameters | |
Number of Component Layers |
1 or 2 |
Quantities |
1 PCB and up |
Lead Time |
10 working days* (5 for manufacture and 5 for assembly) |
Minimum PCB Dimensions |
5mm x 5mm |
Maximum PCB/Panel Dimensions |
340mm x 440mm |
Assembly Type |
SMT – single or double sided THT – single or double sided SMT + THT Mixed Technology – single or double sided |
Components |
Passive Components – 0201 and higher Active Components – from 0,35mm pitch BGA – 0,4mm pitch and above |
Solder Alloy |
Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free |
Solder Paste Stencil |
Laser cut (included in the assembly cost – not delivered with the assembled boards) |
Component Sourcing |
All Components Sourced by Eurocircuits (Components not sourceable by Eurocircuits can be supplied by the customer) |
Quality Inspection |
Visual inspection
Solder Paste Inspection (SPI) BGA Placement X-ray Inspection |
*Notes
- Subject to design meeting our DEFINED IMPEDANCE pool manufacturing and assembly specification and component availability.
- The price cannot be automatically calculated for a PCB containing more than 200 BOM lines or 1000 component placements, our engineering department will evaluate and send you an offer usually within 24 hours.
- These conditions are available in our calculator/Visualizer and will only be confirmed in our order confirmation.