PCB Proto – Bare board & assembly services
Eurocircuits’ PCB Proto service offers customers a simple and no fuss fast PCB Prototyping service. Your data is analysed and once we have checked that your data complies with our technical spec, the board goes in production.
We ignore the options typically needed for series production (peelable masks, via-filling, specific finish, soldermask colours, etc.) as these are not usually crucial for making a functional prototype.
This way we can achieve fast deliveries at attractive prices.
What’s Available
- Bare Board or Assembled PCB’s
- Standard lead times:
- Bare Board PCB’s in 3 Working Days*
- Assembled PCB’s in 6 Working Days*
- Shorter lead times are available in the PCB Calculator
- 1 ,2, 3, 4 or 5 PCB’s – 2 or 4 Layers
- 2 Soldermasks – 2 Legends/Silkscreens
- Lead-free finish (electroless nickel immersion gold or lead-free HAL)
- FR-4 – RoHS Compliant Material Optimised for Lead-free Soldering (see also our blog about materials and lead-free soldering)
- No Tooling Charges
- No Minimum Order Charge
- 100% Manufacturability Check Prior to Production
- PCB Configurator to check and upload design parameters before pricing
- PCB Checker to analyses your data before you place your order
- BOM and CPL analysis
PCB proto Bare Board Service Parameters | |
Number of Layers |
2, 4 |
Quantities |
1, 2, 3, 4 or 5 PCB’s |
Lead Time |
2 or 3 Working Days* |
Maximum PCB Dimensions |
580mm x 425mm for 2L 500mm x 425mm for 4L |
Maximum Customer Panel that can be eC-compatible |
350mm x 250mm |
Minimum Dimensions |
20mm x 20mm for PCB’s 50mm x 50mm for Panels |
Base Material |
|
Board Thickness |
1.55mm |
Base Copper Foil– Outer Layers |
18µm |
Base Copper Foil– inner Layers |
35µm |
Surface Finish |
Any Lead-free (our choice of ENIG or HAL) Hot-air Levelling (HAL) Electroless Gold over Nickel (ENIG) |
Soldermask Colour |
Green |
Extra options |
None |
Legend Colour |
White |
Min. Track Width/Spacing |
0.150mm |
Min. Finished Hole Size |
PTH – 0.250mm NPTH – 0.350mm |
Minimum Outer Layer Pad Diameter |
PTH is Finished Hole Size + 0.350mm NPTH is Finished Hole Size + 0.250mm |
Minimum Inner layer Pad Diameter |
PTH is Finished Hole Size + 0.350mm NPTH is Finished Hole Size + 0.250mm |
Minimum Copper to Board-edge Clearance – Outer Layers |
Routed – 0.250mm |
Minimum Copper to Board-edge – Inner Layers |
Routed 0.400mm |
Slots and Cut-outs |
Tool Sizes – 0.5mm, 1.2mm and 2.0mm |
Delivery Panels |
Break Routing – 2.0mm or V-cut |
Multi-layer Build |
Standard – no option for Blind and Buried Via |
Electrical Test |
Standard for all Boards |
UL Marking |
Available |
Stencil Material |
100µm and 130µm Stainless Steel |
Maximum Stencil Size |
595 x 595 mm |
PCB proto Assembly Service Parameters | |
Number of Component Layers |
1 or 2 |
Quantities |
1, 2, 3, 4 or 5 PCB’s |
Lead Time |
6 working days* (3 for manufacture and 3 for assembly) |
Minimum PCB Dimensions |
5mm x 5mm |
Maximum PCB/Panel Dimensions |
340mm x 440mm |
Assembly Type |
SMT – single or double sided THT – single or double sided SMT + THT Mixed Technology – single or double sided |
Components |
Passive Components – 0201 and higher Active Components – from 0,35mm pitch BGA – 0,4mm pitch and above |
Solder Alloy |
Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free |
Solder Paste Stencil |
Laser cut (included in the assembly cost – not delivered with the assembled boards) |
Component Sourcing |
All Components Sourced by Eurocircuits (Components not sourceable by Eurocircuits can be supplied by the customer) |
Quality Inspection |
Visual inspection
Solder Paste Inspection (SPI) BGA Placement X-ray Inspection |
*Notes
- Subject to design meeting our PCB proto manufacturing and assembly specification and component availability.
- The price cannot be automatically calculated for a PCB containing more than 200 BOM lines or 1000 component placements, our engineering department will evaluate and send you an offer usually within 24 hours.
- These conditions are available in our calculator/Visualizer and will only be confirmed in our order confirmation.