SEMI-FLEX pool – Bare board & assembly services
A flex to install solution
Eurocircuits’ PCB SEMI-FLEX pool is a solution for flex to install PCB’s, typically 4 layers, made entirely of FR4.
Unlike conventional flex-rigid PCB’s, the flexing element is not polyamide but a thin FR4 core with two layers of copper specially treated to flex without cracking.
What’s Available
Bare Board or Assembled PCB’s
- Bare Board or Assembled PCB’s
- Bare Board PCB’s in 7 Working Days* or Assembled PCB’s in 12 Working Days*
- Standard lead times:
- Bare Board PCB’s in 7 Working Days*
- Assembled PCB’s in 12 Working Days*
- Shorter lead times are available in the PCB Calculator
- See Tables Below for Available Specifications
- No Tooling Charges
- No Minimum Order Charge.
- 100% Manufacturability Check Prior to Production
- PCB Configurator to check and upload design parameters before pricing
- PCB Checker to analyses your data before you place your order
- BOM and CPL analysis
What is SEMI-FLEX
SEMI-FLEX is a flex to install PCB, typically 4 layers, made entirely of FR4. Unlike conventional flex-rigid PCB’s, the flexing element is not polyamide but a thin FR4 core with two layers of copper specially treated to flex without cracking.
Why use SEMI-FLEX
SEMI-FLEX is flex to install. Unlike polyamide, the FR4 core is not capable of continuous flexing.
However it will bend a limited number of times (typically 5 – see the technical specification below) at a controlled radius and to any angle.
This makes it an ideal solution where you need to mount two PCB’s in a unit at an angle to each other. Instead of using connectors and cables or a composite flex-rigid PCB, you can design a single FR4 SEMI-FLEX PCB which can be safely bent a sufficient number of times to allow installation and subsequent maintenance as needed
Eurocircuits’ SEMI-FLEX pool
Eurocircuits’ 4-layer SEMI-FLEX PCB’s use a 100 micron central core for the flex area, with 35 micron high-ductility copper foil on each side.
The stack is then made up on each side with a 510 micron FR4 core and two layers of no-flow prepreg (see the full technical specification below).
An alternative technology is to build a 2- or 4-layer PCB and then depth-mill the material away to leave a thin section as the flex area.
We have adopted the core solution even though it needs more operations and so is a little more expensive. It gives a symmetrical build and so a more stable board, while depth-milling is difficult to control meaning that the flex area may have an irregular thickness.
With a core-build we through-mill (rout) the prepreg before pressing. We can then rout the outer layers with any minor variation in cutter depth being absorbed by the void.
SEMI-FLEX pool Service Parameters | |
SEMI-FLEX Area | |
Minimum Bend Radius |
5 mm |
Maximum Bend Angle |
180° |
Maximum Number of Bends |
5 |
SEMI-FLEX length Calculator |
(2 x pi x bend radius) x (bend angle/360) For example, bending 5 times over an angle of 180 degree with a radius of 5mm requires a minimum length of the semi-flex part of 15,7mm |
Copper thickness on SEMI-FLEX Core |
35µm high ductility copper |
Highest Pattern Class |
Class 6 – 150µm track/gap (to accommodate the bending) |
Drill Holes |
Not allowed |
Slots and cut-outs |
Not allowed |
Corners in SEMI-FLEX Area Profile |
Minimum radius 1.00mm |
Corner where a Narrow SEMI-FLEX Area Joins Rigid Area |
Minimum radius 1.00mm |
Recommended |
Use copper on both sides |
Recommended |
Use copper pour around tracks where possible |
RIGID Area | |
Required |
Yes – At each end of the Semi-Flex Material |
Minimum Size |
Width of Semi-Flex Material or 5mm x 5mm whichever is the greater |
Material (rigid and semi-flex cores) |
|
Number of Copper Layers |
4 |
Board Thickness |
1.55mm (see build map) |
SEMI-FLEX Core Thickness |
0.100mm |
Outer Layer Start Copper Foil |
18µm |
Min. Track Width/Spacing |
0.125mm |
Min. Finished Hole Size |
PTH 0.100mm NPTH 0.200mm |
Surface Finish |
Pooling – ENIG, IM Ag |
Soldermask |
Green |
Legend |
White |
Profile |
Break-routing or V-cut |
Slots and Cut-outs (milling) |
Tool sizes – 0.5, 1.2, & 2.0mm – in Rigid Area Only |
Advanced Technologies Allowed |
Pooling – Peelable mask, PTH on board edge, Round edge plating, Copper up to board edge, Heatsink paste, Via filling, Edge Connector Gold Non-Pooling – Carbon pads |
Advanced Technologies Not Allowed |
Blind & Buried vias |
UL Marking |
Not yet available |
Delivery Format |
Preferably delivered in a panel for safe handling |
SEMI-FLEX pool Assembly Service Parameters | |
Number of Component Layers |
1 or 2 |
Quantities |
1 PCB and up |
Lead Time |
12 working days* (7 for manufacture and 5 for assembly) |
Minimum PCB Dimensions |
Width of Semi-Flex Material or 5mm x 5mm – whichever is the greater |
Maximum PCB/Panel Dimensions |
340mm x 440mm |
Assembly Type |
SMT – single or double sided THT – single or double sided SMT + THT Mixed Technology – single or double sided |
Components |
Passive Components – 0201 and higher Active Components – from 0,35mm pitch BGA – 0,4mm pitch and above |
Solder Alloy |
Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free |
Solder Paste Stencil |
Laser cut (included in the assembly cost – not delivered with the assembled boards) |
Component Sourcing |
All Components Sourced by Eurocircuits (Components not sourceable by Eurocircuits can be supplied by the customer) |
Quality Inspection |
Visual inspection
Solder Paste Inspection (SPI) BGA Placement X-ray Inspection |
*Notes
- Subject to design meeting our IMS pool manufacturing and assembly specification and component availability.
- The price cannot be automatically calculated for a PCB containing more than 200 BOM lines or 1000 component placements, our engineering department will evaluate and send you an offer usually within 24 hours.
- These conditions are available in our calculator/Visualizer and will only be confirmed in our order confirmation.