RF pool - Eurocircuits

RF pool – Bare board & assembly services

Eurocircuits’ PCB RF pool service offers designers of High Frequency Board the cost benefits of order-pooling.

RF pool covers a broad spectrum of technology including 2 types of material, 2- and 4-layer PCB’s plus a range of build-up options including mixed RF and FR4, all at acceptable prices.

For other RF requirements, upload your data via the Ask for quotation box for our engineers to evaluate.

What’s Available

Bare Board or Assembled PCB’s

Bare Board or Assembled PCB’s
Bare Board PCB’s in 5 Working Days* or Assembled PCB’s in 10 Working Days*
Standard lead times:
- Bare Board PCB’s in 5 Working Days*
- Assembled PCB’s in 10 Working Days*
- Shorter lead times are available in the PCB Calculator
Isola I-TERA & Rogers RO4350 for pooling – Rogers 4003 series Non-pooling
2 & 4 Layers pooled from 1 piece onwards
100µm Track & Gap pooling – 90 µm Non-pooling
2 Soldermasks – 2 Legends/Silkscreens
Lead-free Finish (electroless nickel immersion gold or lead-free HAL)
No Tooling Charges
No Minimum Order Charge.
100% Manufacturability Check Prior to Production
100% Electrical Test
PCB Configurator to check and upload design parameters before pricing
PCB Checker to analyses your data before you place your order
BOM and CPL analysis

RF pool Service Parameters
Number of Layers	Pooling – 2 & 4 Non-Pooling – 1,6,8,10,12,14,16
Maximum PCB Dimension	355mm x 500mm for ML 425mm x 580mm for 0L, 1L & 2L
Minimum PCB Dimension	5mm x 5mm
Base Material	I-TERA – Tg 215°C Rogers R04350 – Tg 280°C Non-Pooling – Rogers R04003 – Tg 280°C
Prepreg for Multilayers	Isola PCL370HR – Tg 170-180°C
Board Thickness – 0, 1, 2 Layer	0.250mm & 0.500mm Non-Pooling – others available in the online calculator
Board Thickness – 4 layer	1.00mm & 1.55mm Non-Pooling – others available in the online calculator
Board Thickness – 6, 8, 10, 12. 14 & 16 layer	1.55mm Non-Pooling – others available in the online calculator
Base Copper Foil – Outer Layers	Pooling – 1L & 2L – 12µm, 18µm, 35µm Pooling – Multilayers – 12µm, 18µm Non-Pooling – others available in the online calculator
Base Copper Foil – Inner Layers	Pooling – 18µm. 35µm Non-Pooling – others available in the online calculator
Surface Finish	Pooling – ENIG (Chemical Ni/Au), LF HAL, IM Ag
Soldermask Type/Colour	Pooling – Green Non-Pooling – Red, Blue, Black White, Transparent, PixtureBlackWhite
Extra Options	Pooling – Peelable mask, Via filling, Heatsink Paste Hard-gold fingers, Edge Connector Bevelling, Gold Edge Connectors Non-Pooling – Carbon Pads
Legend Colour	Pooling – White Non-Pooling – Black, WhitePIL
Min. Track width/Spacing	Pooling – 0.100mm Non-Pooling – 0.090mm
Min. Finished Hole Size	PTH – 0.100mm NPTH – 0.200mm Non-Pooled – others available in the online calculator
Minimum Outer Layer Pad Diameter	PTH is Finished Hole Size + 0.300mm NPTH is Finished Hole Size + 0.200mm
Minimum Inner layer Pad Diameter	PTH is Finished Hole Size + 0.350mm NPTH is Finished Hole Size + 0.250mm
Minimum Copper to Board Edge Clearance – Outer layers	Routed – 0.250mm V-cut – 0.450mm
Minimum Copper to Board Edge – Inner Layers	Routed – 0.400mm V-cut – 0.450mm
Copper Options	Copper up to Board Edge Plated Holes on Board Edge Round-edge Plating
Slots and Cut-outs	Tool Sizes – 0.5, 1.2 & 2.0mm
Delivery Panels (customer panels)	Break-routed with 2 mm Tool or V-cut
Maximum Customer Panel that can be eC-compatible	Pooled – 350 x 250mm
Multilayer Build	Standard, eC-type 8, eC-type 9 For specials request a quotation
Electrical test	Standard
UL Marking	Not yet available
Stencil Material	100µm and 130µm Stainless Steel
Maximum Stencil Size	595mm x 595mm

RF pool Assembly Service Parameters
Number of Component Layers	1 or 2
Quantities	1 Piece and Onwards
Lead Time	10 working days* (5 for manufacture and 5 for assembly)
Minimum PCB Dimensions	5mm x 5mm
Maximum PCB/Panel Dimensions	340mm x 440mm
Assembly Type	SMT – single or double sided THT – single or double sided SMT + THT Mixed Technology – single or double sided
Components	Passive Components – 0201 and higher Active Components – from 0,35mm pitch BGA – 0,4mm pitch and above
Solder Alloy	Basis SAC 305 Sn 96,5 Ag3 Cu 0,5 lead-free
Solder Paste Stencil	Laser cut (included in the assembly cost – not delivered with the assembled boards)
Component Sourcing	All Components Sourced by Eurocircuits (Components not sourceable by Eurocircuits can be supplied by the customer)
Quality Inspection	Visual inspection Solder Paste Inspection (SPI) BGA Placement X-ray Inspection

*Notes

Subject to design meeting our RF pool manufacturing and assembly specification and component availability.
The price cannot be automatically calculated for a PCB containing more than 200 BOM lines or 1000 component placements, our engineering department will evaluate and send you an offer usually within 24 hours.
These conditions are available in our calculator/Visualizer and will only be confirmed in our order confirmation.